Electronic packaging device and method

ABSTRACT

A device for electrically interconnecting and packaging electronic components and method for manufacturing the device. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices. In another aspect of the invention, the device includes a series of specially shaped through-holes provided within the base member to allow the routing of wire leads there through. The bottom surface of the base member is chamfered to facilitate “wicking” of molten solder up the wire leads during soldering, thereby allowing for a stronger and more reliable joint.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.09/947,176 entitled “ELECTRONIC PACKAGING DEVICE AND METHOD”, filed onSep. 4, 2001, which is a continuation of Ser. No. 09/313,820, filed onMay 18, 1999, now U.S. Pat. No. 6,395,983 issued May 28, 2002.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to non-semiconductor electricaland electronic elements used in printed circuit board applications andparticularly to an improved package and method of packagingmicrominiature electronic components.

2. Description of Related Technology

Dual in-line chip carrier packages (DIPs) are well known in the field ofelectronics. A common example of a DIP is an integrated circuit, whichis typically bonded to a ceramic carrier and electrically connected to alead frame providing opposed rows of parallel electrical leads. Theintegrated circuit and ceramic carrier are normally encased in a black,rectangular plastic housing from which the leads extend.

The continuing miniaturization of electrical and electronic elements andhigh density mounting thereof have created increasing challengesrelating to electrical isolation and mechanical interconnection. Inparticular, substantial difficulty exists in establishing reliable andefficient connections between fine gauge (AWG 24 to AWG 50) copper wireleads associated with various electronic elements within a given DIP.One particularly useful prior art method of connecting element leads tothe lead frame terminals (or interconnecting the leads of two or moreelectronic elements) is disclosed in U.S. Pat. No. 5,015,981, which isillustrated herein in FIG. 1. Commonly known as “interlock base”technology, this method involves routing the wire lead(s) 2 to an unusedlead frame slot or channel 3 located at the edge of the non-conductingbase member 10, as shown in FIGS. 1 and 2. Each of these channels isdesigned to receive a single conductive lead frame terminal 4, whichwhen assembled asserts an inward bias on the package thereby forcingcontact between the conductive terminals 4 of the lead frame and theelectronic element lead(s) 2; see FIG. 2. This method has also typicallyutilized a locking mechanism, such as a small tab 12 or extension on thefour corner lead terminals 14, 15, 16, 17, which locks into a plasticprotrusion 18 of similar dimensions using the spring tension associatedwith the individual lead terminals 4 of the lead frame 34. Refer againto FIG. 2.

However, while simple, this locking mechanism design suffers from threeprimary disabilities: (i) the relatively low amount of normal force thatthe package can sustain during manufacture without dislodging ordeforming the locking tabs; (ii) the localization of the resistive orreaction force provided by the locking tabs on the four corners of thepackage; and (iii) the ability of the tabs to provide resistive force inonly one direction. These limitations ultimately translate torestrictions relating to the size of the package that can be reliablyassembled. For example, the use of a prior art lead frame 34 and basemember 10 as described above works well for 16 pin packages, whichtypically have a surface area (measured across the top of the package)on the order of 0.1 square inches. When larger packages with moresurface area and leads are manufactured, however, the lead frame oftendislocates and separates from the base member, thereby allowing formovement and/or loss of contact of the lead frame terminals with thecomponent leads. This reduces the reliability of the final package as awhole, and increases the cost of manufacturing, since more defective ornon-conforming devices are manufactured in a given production run. Thisdislocation and separation is largely a result of the increased downwardforce associated with transfer molding the larger package. Additionally,as previously noted, the distribution of force in the larger packagewith respect to the leads is less desirable, since the spacing betweenthe four locking tabs on the corners of the package is increased,thereby allowing greater flexing and distortion of the leads interposedthere between. The ability of the lead frame terminals 4 to move in onedirection also contributed to device failure in that the potential formisalignment and separation of the lead frame and base.

One “work-around” solution for these problems has comprised the use ofan adhesive or epoxy placed between the lead frame terminals 4 and thebase member 10 so as to maintain a rigid contact between the two.However, this solution obviates many of the benefits of the interlockbase technology by introducing additional process steps, materials, andcuring times.

In a somewhat unrelated aspect, the aforementioned interlock basetechnology suffered from another disability; namely, a significantpotential for shearing off of the soldered leads after formation.Specifically, one prior design of the interlock base used a series of“through-holes” 13 designed to accommodate multiple wire leads 2 andfacilitate their bonding via a soldering process, as shown in FIGS. 3aand 3 b. See also Applicant's pending U.S. patent application Ser. No.08/791,247, entitled “Through-Hole Interconnect Device With IsolatedWire Leads and Component Barriers” filed Jan. 30, 1997, which isincorporated herein by reference in its entirety. Basically, the wireleads to be joined were twisted and routed through the through-hole soas to protrude from the bottom of the package as shown in FIG. 3aherein. Through-holes having an essentially flat or unchamfered bottomsurface were used. During soldering, there was a tendency for the moltensolder 19 to form a bubble 20 around the egress point of the leads fromthe feed-through hole at the bottom surface. This bubble effectivelydisplaced solder from the leads as shown in FIG. 3b, thereby making theformation of the solder joint occur at a position lower on the leadsthan would occur if the bubble were not present. When the extensiveportion of leads was subsequently trimmed, the entire solder joint wouldsometimes be inadvertently trimmed off as well, thereby potentiallyresulting in failure of the joint.

Based on the foregoing, it would be highly desirable to provide animproved apparatus and method for connecting a lead frame to a packageof any size such that the physical forces associated with molding of thepackage and soldering of the leads would not result in movement orseparation of the lead frame from the interlock base or wire leadsdisposed within the lead channels. Additionally, such an improvedapparatus and method would allow for more complete soldering of anyelectrical joints located within feed-through holes within the interlockbase, thereby reducing or eliminating failure of these joints due toinadvertent removal during processing.

SUMMARY OF THE INVENTION

The present invention satisfies the aforementioned needs by providing animproved microelectronic component package and interconnect devicehaving a plurality of specially shaped lead channels which allow leadterminals to be more rigidly captured therein.

In a first aspect of the invention, an improved microelectronic devicebase member is disclosed which is fabricated from non-conductivematerial and includes at least one electronic component recess and aplurality of specially shaped lead channels. These lead channels areadapted to receive specially shaped lead terminals associated with alead frame such that the lead frame and terminals are restricted fromany significant movement within the lead channels during devicefabrication. In one embodiment, the shapes of the lead channels and leadterminals is such so as to prevent longitudinal movement of the leadterminals within the channels in either direction, yet facilitate easyassembly. Such an arrangement allows the device to be easily assembledwithout additional labor or process steps, and also allows thefabrication of larger packages with a high degree of reliability. Thedisclosed base member also optionally includes a plurality of chamferedthrough-holes which permit more secure joining of the wire leads of theelectronic component(s) when installed within the base member.

In a second aspect of the invention, an improved microelectronic deviceis disclosed utilizing the aforementioned base member and leadterminals. The device includes at least one electronic component havingwire leads which is disposed within the base member, and a plurality ofshaped lead terminals received within the shaped lead channels of thebase member. The shape of the lead terminals and corresponding channelsis such to restrict the movement of the lead terminals (and associatedlead frame) within the channels during device fabrication, therebyallowing for constant and firm contact between the component wire leadsdisposed within the lead channels and the lead terminals. This designaccordingly allows the reliable manufacturing of larger devices with aminimum of process steps. The device is also encapsulated in a polymerovermolding.

In a third aspect of the invention, an improved method for fabricatingthe aforementioned device is disclosed. In one embodiment of the method,the aforementioned base member is formed from a non-conductive materialusing a molding process. The electronic component(s) and lead frame arealso formed. The electronic component is inserted in the recess of thebase member, and its wire leads routed through one or more of the leadchannels in the base member. Additionally, any wire leads desired to bejoined with those of other components are twisted and inserted in thethrough-holes such that they protrude from the bottom of the basemember. Next, the lead frame is mounted on the base member such that theshaped lead terminals are received and locked within the correspondingshaped lead channels, thereby forming a rugged electrical contactbetween the lead terminals and any wire leads routed in the channels.The base member, wire leads, and lead terminals are then dip-soldered toform permanent electrical joints. The wire leads are trimmed, and thedevice encapsulated in a polymer overmolding using a transfer moldingprocess. The extensive portions of the lead terminals are then trimmedfrom the lead frame and formed to the desired shape.

These and other objects and features of the present invention willbecome more fully apparent from the following description and appendedclaims taken in conjunction with the following drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a prior art microelectronic packagingdevice illustrating the relationship between the lead terminals and leadchannels.

FIG. 2 is perspective view of the prior art device of FIG. 1,illustrating the electrical interconnection between the component leadand lead terminals within a single lead channel, and the lockingmechanism associated therewith.

FIGS. 3a and 3 b are side cross-sectional views of the prior art deviceof FIG. 1, illustrating the prior art wire lead through-holeconfiguration before and after soldering, respectively.

FIG. 4 is a perspective view of a first embodiment of the base memberand associated lead terminals of the present invention

FIG. 4a is detail plan view of the lead channels and lead terminals ofFIG. 4.

FIG. 4b is a detail perspective view of one of the second lead channelsof the base member of FIG. 4, illustrating the “T-bar” arrangement.

FIG. 5 is a plan view of a second embodiment of the lead channels andassociated lead terminals according to the present invention.

FIG. 6 is a plan view of a third embodiment of the lead channels andassociated lead terminals according to the present invention.

FIG. 7 is a cross-sectional view of the first embodiment of FIG. 4,taken along line 7—7, illustrating the through-hole arrangement of thepresent invention.

FIG. 8 is a perspective view of the electronic packaging device of thepresent invention prior to encapsulation, illustrating the placement ofthe various components with respect to the base member of FIG. 4.

FIG. 9 is a perspective view of the electronic packaging device of thepresent invention, after encapsulation.

FIG. 10 is a flow chart illustrating one embodiment of the method ofmanufacturing the electronic packaging device according to the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Reference is now made to the drawings wherein like numerals refer tolike parts throughout.

FIGS. 4 and 4a illustrate a first embodiment of the base member 100 andassociated lead terminals 102 according to the present invention. Asillustrated in FIG. 4, the base member 100 is comprised generally of athree-dimensional base body 104 having one or more electronic componentrecesses 106 formed at least partly therein. The body 104 includes a topsurface 110, side surfaces 112 a-112 d, and a bottom surface 114. Thebody 104 also includes a plurality of first lead channels 116 and aplurality of second lead channels 118 formed within the body 104,described in greater detail below. The base body 104 is ideallyfabricated from a non-conductive material such as a liquid crystalpolymer using an injection molding process, although other materials andprocesses may be used. One or more wire lead through-holes 105 are alsooptionally formed in the base body 104, as described below withreference to FIG. 7. In the present embodiment, the lead channels 116,118 are disposed on the opposing, elongate side surfaces 112 a, 112 c ofthe base body, and oriented in a vertical direction such that thechannels 116, 118 run generally from the top surface 110 to the bottomsurface 114, and are parallel to one another. This orientationfacilitates the routing of wire leads associated with the electroniccomponents disposed in the recesses 106 into the lead channels 116, 118when the packaging device is assembled; see FIG. 8. The individualrecesses 106 are shaped to receive any one of a variety of differentelectronic elements, such as toroidal induction coils also as shown inFIG. 8. While the discussion presented herein is specific to theillustrated toroidal induction coils, it can be appreciated that avariety of different electronic components may be used in conjunctionwith the invention with equal success.

As shown in FIG. 4, a plurality of first and second lead terminals 120,122 are received within the lead channels 116, 118 when the packagingdevice is assembled. These lead terminals 120, 122 are part of a largerlead frame 130 before being separated therefrom during manufacturing.The use of a lead frame allows all of the lead terminals to be placeswithin their respective lead channels in one processing step, as isdescribed further below. The lead frame 130 (and attached lead terminals120, 122) of the present embodiment are fabricated from an electricallyconductive metal alloy, although other materials may conceivably beused.

Referring again to FIG. 4a, the structure and operation of the first andsecond lead channels 116, 118 and their associated lead terminals 120,122 are described. The first lead channels 116 are formed so as toinclude a first retention element 134. In the present embodiment, theretention elements 134 comprise a shape 136 formed in each or a subsetof the first lead channels 116. The shape 136 comprises a narrow portion140 at the top end 142 of the channel 116, and a wider portion 144adjacent to and below the narrow portion 140, hereinafter referred to asa “bayonet” shape. A complementary shape 150 in the corresponding firstlead terminal 120, having a narrow portion 152 atop a wider portion 154,is formed to permit the lead terminal 120 to engage the lead channel 116to prevent the lead terminal 120 from moving in a first longitudinaldirection 156 beyond a desired point within the lead channel 116 whenthe terminal 120 and base member 100 are joined.

Similarly, as shown in FIGS. 4a and 4 b, the second lead channels 118include a retention element 160 in the form of a shape 162, the latterdesigned to engage the second lead terminals 122 when received withinthe channels 118. The shape 162 employed in the second lead channels118, however, is different than that used in the first lead channels116, so as to allow the lead terminals 120, 122 to be inserted intotheir respective lead channels 116, 118 from the same direction, yetprevent the movement of the second lead terminals 122 in a secondlongitudinal direction 164 once inserted. Specifically, the second leadchannels 118 use a modified “bayonet” shape having a ramp portion 165proximate to the top portion 167 of the channel 118, as shown in FIG.4b. This ramp portion 165 receives and urges a “T-bar” shape 169 formedon the distal end 170 of all or a subset of the second lead terminals122 in a direction away from the base body 104 when the terminals 122are inserted into the second channels 118. When fully inserted, theT-bar shape 169 of each terminal 122 engages a shoulder region 174 onthe top surface of the base body 104, so as to prevent the withdrawal ofthe second lead terminals from the second lead channels 118. Since thefirst and second lead terminals 120, 122 are rigidly connected via thelead frame 130 (prior to severance) as previously described, theinteraction of the first lead channels 116 and their corresponding leadterminals 120, and the second lead channels 118 and their correspondingterminals 122, prevent the lead frame from moving substantially ineither the first or second longitudinal directions 156, 164 when theterminals 120, 122 are mated to the base member 100. In this manner, thelead terminals (and lead frame) are “locked” to the base member 100 viaboth the first and second lead channels. Furthermore, the lead terminals120, 122 are precluded from moving laterally within the lead channels116, 118 by the close tolerance fit between the terminals and the sidewalls of the channels.

It is noted that since the lead frame 130 and lead terminals 120, 122 ofthe present embodiment are constructed of a metallic alloy having somedegree of resiliency, the outward deflection of the T-bar shape 169 ofthe second lead terminals 122 produces an inward bias force resistingsuch deflection. In this fashion, as the lead frame 130 is being mountedon the base member 100, and the terminals 120, 122 inserted into theirrespective lead channels 116, 118, a resistive force opposing themovement of the lead terminals 120, 122 longitudinally within thechannels is created until the leads (and lead frame) are in their“locked” position, at which point the T-bar shapes 169 are receivedwithin the shoulder region 174 of the base body 104. Hence, the leadframe and terminals are designed to “snap” onto the base member in africtional manner.

Note also that the width of the base body (or alternatively, the depthof the lead channels) may also be varied as a function of verticalposition on the base body so as to provide a variable interference fitwith the lead terminals. Such a variable fit may be useful, for example,during assembly, so as to permit an assembler to more easily place andalign the ends of the lead terminals 120, 122 within the lead channels116, 118 before sliding the lead frame 130 fully into position.

It is further noted that while the embodiment of FIGS. 4-4b utilizesnine first lead channels 116 which are interleaved or interspersed withthree second lead channels 118 on each of the elongate sides of the body104 in a predetermined pattern, other patterns and combinations of leadchannels and associated terminals may be used. For example, first andsecond lead channels/terminals could be dispersed in on alternatingbasis (i.e., one first channel, one second channel, one first channel,etc.). Alternatively, the orientation of each of the lead channels couldbe inverted (i.e., rotated 180 degrees) with respect to the base body104 such that the lead frame 130 and terminals 120, 122 are insertedonto the top of the body 104 rather than the bottom. Many suchvariations are possible, and all being considered within the scope ofthe invention.

Referring now to FIG. 5, a second embodiment of the present invention isdisclosed. In this second embodiment, a series of rectangular retentionelements 200 are formed within all or a subset of the lead channels 202of the base member 206. These retention elements 200 are arranged at agiven vertical elevations along the sides of the base member forsimplicity of manufacturing, although other arrangements may be used. Asin the embodiment of FIG. 4, a ramp portion 208 is included within eachof the lead channels 202 to facilitate guiding and biasing the leadterminals 210 during mounting of the lead frame 212. When the lead frame212 is properly positioned on the base member 206, the shapes 214 formedin the lead terminals 210 engage the retention elements 200 in the leadchannels 202 so as to restrict movement of the lead terminals within thelead channels in both longitudinal directions 220, 222. As with theembodiment of FIG. 4, the lead frame 212 and base member 206 “snap”together when the lead frame 212 is properly positioned due to thebiasing force on the lead terminals 202 and the physical relationshipbetween the components.

FIG. 6 illustrates a third embodiment of the base member and leadterminals of the present invention. In this third embodiment, a seriesof “notch” recesses 300 are formed within all or a subset of the leadchannels 302 of the base member 304. The lead terminals 306 include acorresponding shape 308 formed therein which cooperates with the recess300 within the respective lead channel 302 to retain the lead terminals306 in a fixed position when the lead frame 310 is mounted on the basemember 304. The fit between the lead channel recess 300 and the shape308 of the lead terminals is such that the lead terminals again “snap”into their recesses at a desired position, aided by a plurality of rampportions 311 disposed within the lead channels 302. Longitudinalmovement of the lead terminals 306 is restricted by the cooperation ofthe shapes 308 and the recesses 300.

FIG. 7 is a cross-sectional view of the first embodiment of FIG. 4,illustrating the through-hole arrangement of the present invention. Thebase body 104 includes at least one through-hole 105 disposed within thebody 104 so as to facilitate the routing and bonding of the wire leads402 associated with the electronic component(s) 404 contained within thebase member 100. The individual wire leads 402 of the components 404 arejoined, such as by twisting them together, and disposing them within thethrough-hole(s) 105 such that the distal portion 405 of the joined leadsextends below the bottom surface 114 of the base body 104. Thisarrangement facilitates mass soldering of several such joined leads,such as by dip soldering or wave soldering. The through-holes 105 arefurther provided with a chamfered region 406 disposed adjacent to thebottom surface 114 as shown in FIG. 7. This chamfered region 406 helpspreclude the formation of solder bubbles in the area of the through-hole(or alternatively, if a bubble does form, allows the bubble to riseabove the plane of the bottom surface 114), thereby allowing solder 407to “wick” up the joined leads 402 further and above the plane of thebottom surface as well. This approach dramatically reduces theoccurrence of inadvertent trimming of the solder joint during subsequentprocess steps, since the solder joint now extends well into thethrough-hole 105.

It will be readily appreciated that the number, size, location, andorientation of the through-holes 105 of the present invention may bevaried as desired. Furthermore, such through-holes may be used with anyof other embodiments of the invention, such as those described withreference to FIGS. 5 and 6 above.

Referring now to FIG. 8, the electronic packaging device of the presentinvention is now described. As shown in FIG. 8, the device 500 comprisesthe base member 100 previously discussed with respect to FIGS. 4-4b,lead terminals 120, 122 mounted on a lead frame 130, as well as one ormore electronic components 404 having wire leads 402. Note that thedevice shown in FIG. 8 is in a state of partial completion, prior toencapsulation, and is inverted from that shown in FIG. 4, to betterillustrate the relationship between the electronic components 404, wireleads 402, lead channels 116, 118, and lead terminals 120, 122. It willbe recognized that while the base member 100 and leads 120, 122 of FIGS.4-4b are utilized in the device 500 of FIG. 8, other base member andlead terminal combinations may be used with equal success. Theembodiment of FIG. 8 is therefore merely illustrative.

The electronic component 404 of the present embodiment comprise aninduction coil having a doughnut shaped iron core member 522 aroundwhich are wrapped coils of thin gauge wire, with the ends of the wireextending outward and forming terminal ends or leads 402. The components404 of the present embodiment are disposed within their respectiverecesses 106 of the base body 104 in such a manner that the central axisof each coil element is aligned with that of all other coil elements asshown in FIG. 8, although it will be appreciated that other orientationsand configurations may be used. This arrangement is desirable in that aminimum of space is required to accommodate a given number ofcomponents, and field interactions between each component 404 and itsneighboring component(s) are generally spatially uniform and consistentfrom component to component. This assists in distributing any potential(voltage) generated by alternating magnetic or electric fields presentduring operation more evenly along the windings of each element, therebyincreasing overall device longevity and permitting “tuning” of theelectrical response of the package as a whole. Note that silicone oradhesive may optionally be used within the recesses 106 to maintain thecomponents 404 in the desired position during assembly of the device500.

Through-holes 105 of the type described with reference to FIG. 7 hereinare also provided in each of the component barriers 526. Thesethrough-holes allow the interconnection of leads from the variouselectronic components 404 installed in the recesses, thereby providinggreat flexibility in the routing and interconnection of leads duringboth the design and assembly phases.

In addition to being joined in the through-holes 105, some of the wireleads 402 of the components 404 are routed into the lead channels 116,118 of the base member 100 prior to installation of the lead terminals120, 122 so as to form an electrical contact with the lead terminals120, 122 when the device 500 is assembled. Both the wire lead/electricalterminal contacts 530, and the joined wire leads 402 disposed within thethrough-holes, are soldered in order to form a more permanent electricaljoint. Ultimately, the device 500 is encapsulated in a polymerencapsulant 550 of the type well known in the electronic arts, and thelead terminals 120, 122 trimmed from the leadframe and deformed to thedesired profile as illustrated in FIG. 9.

Method of Manufacturing

The method of assembling the electronic packaging device of the presentinvention is now described with reference to FIG. 10. In the firstprocess steps 602, 604, 606 of the method 600, the base member 100, leadframe 130, and electronic component(s) 404 are formed using processeswell understood in the art. For example, the base member 100 may beformed using an injection molding process, and the lead frame formedfrom a metal alloy using a stamping and bending process. Many differentmethods of forming these components are known and may be used with equalsuccess.

Next, the electronic components 404 are placed within the recessesformed within the base member 100 in step 608. A silicone gel or otheradhesive may optionally be used to aid in retaining the components 404in their recesses during subsequent processing. The wire leads 402 ofthe electronic components are then routed into the lead channels 116,118 in the next step 610. If the base member 100 includes through-holes105 such as those previously described, certain of the wire leads of thecomponents 404 are then mechanically joined together (typically, using atwisting or comparable process) in step 612, and then routed into thethrough-holes in step 614 such that the distal portion 405 of the leads402 extends below the bottom surface of the base member 100 as shown inFIG. 7. In the next step 616, the formed lead frame 130 is placed on thebase member 100 in the proper orientation, and the lead terminals 120,122 are “locked” into their respective lead channels 116, 118 in thefollowing step 618 as, previously described. The partially assembleddevice is then soldered, such as by a dip soldering process, in step620. When the aforementioned solder process is completed, the flux isthen cleaned with an isopropyl alcohol using an ultrasonic cleaner orcomparable means per step 622. The wire leads (both those routed throughthe lead channels 116, 118, and those routed into the through-holes 105)are then trimmed as necessary in step 624. In the next step 626, thedevice is encapsulated in a suitable plastic or polymer material, whichmaterial forms a smooth rectangular package as illustrated in FIG. 9.The device is preferably encapsulated in an IC grade thermoset epoxy550, such as that available from Dexter under the Trademark HYSOLMG25F-05, or equivalent thereof. Thereafter, in steps 628 and 630respectively, the lead frame is trimmed and formed in a die press or thelike to finish the lead terminals 120, 122 in a suitable form, foreither surface mounting or pin mounting as desired.

It will be recognized that while the aforementioned method 600 isdescribed in terms of a specific sequence of steps, the order of certainof these steps may be permuted if desired. For example, while the method600 of FIG. 10 routes the lead wires into the lead channels per a firststep 610 prior to joining and routing the lead wires per subsequentsteps 612, 614, the order of these two operations may be reversed.Similarly, the formation of the base member, lead frame, and electroniccomponents may occur in series, rather than parallel as shown in FIG.10. Additionally, it is noted that other process steps may be added,such as for inspection and/or testing of certain components, and othersteps optionally deleted (such as those relating to joining and routingthe joined the wire leads if no through-holes are employed within thedevice). Many such permutations and combinations are possible, all beingconsidered within the scope of the present invention.

While the above detailed description has shown, described, and pointedout the fundamental novel features of the invention as applied tovarious embodiments, it will be understood that various omissions,substitutions, and changes in the form and details of the device orprocess illustrated may be made by those skilled in the art withoutdeparting from the spirit or essential characteristics of the invention.The described embodiments are to be considered in all respects only asillustrative and not restrictive. The scope of the invention is,therefore, indicated by the appended claims rather than by the foregoingdescription. All changes which come within the meaning and range ofequivalence of the claims are to be embraced within their scope.

What is claimed is:
 1. A method of manufacturing an electronic device,comprising the steps of: forming a three-dimensional base member havingat least one electronic component recess, a plurality of first leadchannels, and a plurality of second lead channels, said first leadchannels having a first shape and said second lead channels having asecond shape; forming an electronic component having wire leads; forminga plurality of first lead terminals, said first lead terminals having athird shape adapted to cooperate with said first shape of said firstlead channels; forming a plurality of second lead terminals, said secondlead terminals having a fourth shape adapted to cooperate with saidsecond shape of said second lead channels; disposing said electroniccomponent in said recess; routing at least one of said leads into atleast one of said first and second lead channels; and mating said firstand second lead terminals within said first and second channels,respectively, such that said first shape cooperates with said thirdshape, and said second shape cooperates with said fourth shape, torestrict the movement of said first and second lead terminals withinsaid first and second lead channels, respectively.
 2. The method ofclaim 1, wherein the steps of forming a plurality of first leadterminals and forming a plurality of second lead terminals comprise theact of forming a unitary lead frame having said pluralities of first andsecond lead terminals disposed thereon.
 3. The method of claim 2,wherein the act of forming said lead frame comprises the act of stampingsaid lead frame from a sheet of metal.
 4. The method of claim 2, furthercomprising separating said first and second electrical leads from saidlead frame.
 5. The method of claim 1, further comprising exposing atleast a portion of said electronic device to solder in order to bond atleast some of said first and second electrical terminals to said wireleads of said electronic component.
 6. The method of claim 5, furthercomprising encapsulating at least a portion of said electronic deviceusing a molding process.
 7. A method of manufacturing an improvedmicroelectronic device base member, comprising: forming a non-conductivebase member having at least one recess adapted to house an electroniccomponent, and having a plurality of lead channels; forming a firstshape within said lead channels; forming a lead frame comprising aplurality of lead terminals, wherein each of said lead terminalscomprises a second shape adapted to engage said first shape; locatingsaid electronic component in said at least one recess, wherein said atleast one electronic component has a plurality of wire leads exposedfrom said recess; locating a first of said plurality of wire leads inone of the plurality of lead channels; and engaging said plurality oflead terminals with said plurality of said lead channels, wherein saidfirst shape of said lead channels engages with said second shape of saidlead terminals thereby preventing longitudinal motion of said leadterminals within said lead channels.
 8. The method of claim 7, furthercomprising: forming at least one chamfered through-hole in said basemember, wherein said through-hole is adapted to accept one or more ofsaid wire leads for electrical interconnecting and is further adapted tofacilitate said electrical interconnecting.
 9. In an electronic package,a method of preventing motion in a longitudinal direction of a leadterminal in a lead channel having two opposing walls, comprising:forming a retaining area in said lead channel by forming a shape on eachof said two walls of said lead channel; forming a capture area on saidlead terminal; and inserting said lead terminal into said lead channel,whereby said retaining area cooperates with said capture area on saidlead terminal to prevent said lead terminal from moving in said leadchannel in said longitudinal direction.
 10. The method of claim 9,wherein said lead terminal further comprises two elongated sides andwherein said capture area is formed on both of said elongated sides ofsaid lead terminal.
 11. The method of claim 10, wherein said twoopposing walls further comprise a first wall and a second wall andwherein said shape on said first wall is substantially the same as saidshape on said second wall.
 12. The method of claim 10, wherein saidretaining area further comprises a narrow portion near an upper end ofsaid lead channel.
 13. The method of claim 11, wherein said retainingarea further comprises a bayonet shape.
 14. The method of claim 10,further comprising: forming a second retaining area in an adjacent leadchannel; and forming a second capture area on an adjacent lead terminalthat is adjacent said lead terminal, wherein said second retaining areaand said second capture area cooperate to prevent said adjacent leadterminal from moving within said adjacent lead channel in a secondlongitudinal direction.
 15. The method of claim 14, wherein said secondretaining area comprises a shape that is different from said retainingarea.
 16. The method of claim 14, wherein said longitudinal directionand said second longitudinal direction are different.
 17. The method ofclaim 16, wherein said longitudinal direction and said secondlongitudinal direction are generally opposite directions.